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INTEGRATED CIRCUITS
DATA SHEET
TDA1308; TDA1308A Class AB stereo headphone driver
Product specification Supersedes data of 2002 Feb 27 2002 Jul 19
Philips Semiconductors
Product specification
Class AB stereo headphone driver
FEATURES * Wide temperature range * No switch ON/OFF clicks * Excellent power supply ripple rejection * Low power consumption * Short-circuit resistant * High performance - high signal-to-noise ratio - high slew rate - low distortion * Large output voltage swing.
TDA1308; TDA1308A
GENERAL DESCRIPTION The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be used at low supply voltages.
QUICK REFERENCE DATA VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. SYMBOL VDD PARAMETER supply voltage single dual supply voltage single dual VSS IDD Ptot Po (THD + N)/S negative supply voltage supply current total power dissipation maximum output power total harmonic distortion plus noise-to-signal ratio no load no load THD < 0.1%; note 1 note 1 - - RL = 5 k; note 2 RL = 5 k; note 3 RL = 5 k S/N cs PSRR Tamb Notes 1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). 2. VDD = 2.4 V; VO(p-p) = 1.62 V (at -4.8 dBV); for TDA1308A only. 3. VDD = 2.4 V; VO(p-p) = 1.19 V (at -7.96 dBV); for TDA1308A only. signal-to-noise ratio channel separation RL = 5 k power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV ambient temperature - - - 100 - - - -40 0.03 -70 -92 -52 -101 110 70 105 90 - 0.06 -65 -89 -40 - - - - - +85 % dB dB dB dB dB dB dB dB C TDA1308A 2.4 1.2 -1.5 - - - 5.0 2.5 -2.5 3 15 60 7.0 3.5 -3.5 5 25 - V V V mA mW mW TDA1308 3.0 1.5 5.0 2.5 7.0 3.5 V V CONDITIONS MIN. TYP. MAX. UNIT
2002 Jul 19
2
Philips Semiconductors
Product specification
Class AB stereo headphone driver
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1308 TDA1308T TDA1308AT TDA1308TT BLOCK DIAGRAM DIP8 SO8 SO8 TSSOP8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil)
TDA1308; TDA1308A
VERSION SOT97-1 SOT96-1 SOT96-1 SOT505-1
plastic small outline package; 8 leads; body width 3.9 mm plastic small outline package; 8 leads; body width 3.9 mm plastic thin shrink small outline package; 8 leads; body width 3 mm
handbook, halfpage
OUTA INA(neg) INA(pos)
1 2 3
TDA1308(A)
8 VDD
7 6 5
OUTB INB(neg) INB(pos)
VSS
4
MKA779
Fig.1 Block diagram.
PINNING SYMBOL OUTA CD) INA(pos) VSS INB(pos) INB(neg) OUTB VDD PIN 1 2 3 4 5 6 7 8 output A inverting input A non-inverting input A negative supply non-inverting input B inverting input B output B positive supply Fig.2 Pin configuration. DESCRIPTION
handbook, halfpage
OUTA 1 INA(neg) 2
8 VDD 7 OUTB INB(neg) INB(pos)
TDA1308(A)
INA(pos) VSS 3 4
MKA780
6 5
2002 Jul 19
3
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
handbook, full pagewidth
VDD I1
INA/B(pos) INA/B(neg) OUTA/B
M1
M2
A1
M3
Cm M4 D1 D2 D3 D4 M5 A2 M6
VSS
MKA781
Fig.3 Equivalent schematic diagram.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD tSC(O) Tstg Tamb Vesd PARAMETER supply voltage output short-circuit duration storage temperature operating ambient temperature electrostatic discharge note 1 note 2 Notes 1. Human body model: C = 100 pF; R = 1500 ; 3 pulses positive plus 3 pulses negative. 2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 ; 3 pulses positive plus 3 pulses negative. THERMAL CHARACTERISTICS SYMBOL Rth j-a DIP8 SO8 TSSOP8 QUALITY SPECIFICATION In accordance with "UZW-BO/FQ-0601". The numbers of the quality specification can be found in the "Quality Reference Handbook". The handbook can be ordered using the code 9398 510 63011. 2002 Jul 19 4 PARAMETER thermal resistance from junction to ambient in free air 109 210 220 K/W K/W K/W VALUE UNIT Tamb = 25 C; Ptot = 1 W CONDITIONS 0 20 -65 -40 -2000 -200 MIN. - +150 +85 +2000 +200 MAX. 8.0 V s C C V V UNIT
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
CHARACTERISTICS VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. SYMBOL Supplies VDD supply voltage single dual supply voltage single dual negative supply voltage supply current total power dissipation input offset voltage input bias current common mode voltage open-loop voltage gain maximum output current output resistance output voltage swing TDA1308 3.0 1.5 TDA1308A 2.4 1.2 -1.5 - - - - 0 - - - 0.75 1.5 0.1 - - RL = 5 k CL load capacitance AC characteristics (THD + N)/S total harmonic distortion plus note 2 noise-to-signal ratio note 3 RL = 5 k; note 2 S/N fG Po Ci SR B signal-to-noise ratio unity gain frequency maximum output power input capacitance slew rate power bandwidth open-loop; RL = 5 k (THD + N)/S < 0.1% unity gain inverting unity gain inverting - - - - - - 100 - - - - - -70 0.03 -52 0.25 -101 0.0009 110 5.5 60 3 5 20 -65 0.06 -40 1.0 - - - - - - - - dB % dB % dB % dB MHz mW pF V/s kHz - - 5.0 2.5 -2.5 3 15 10 10 - 70 60 0.25 - - - 90 70 105 - 7.0 3.5 -3.5 5 25 - - 3.5 - - - 4.25 3.5 4.9 - - - 200 V V V mA mW mV pA V dB mA V V V dB dB dB pF 5.0 2.5 7.0 3.5 V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VSS IDD Ptot VI(os) Ibias VCM Gv IO RO VO
no load no load
DC characteristics
RL = 5 k (THD + N)/S < 0.1% note 1 RL = 16 RL = 5 k fi = 100 Hz; Vripple(p-p) = 100 mV
PSRR cs
power supply rejection ratio channel separation
2002 Jul 19
5
Philips Semiconductors
Product specification
Class AB stereo headphone driver
Notes 1. Values are proportional to VDD; (THD + N)/S < 0.1%. 2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB). 3. VDD = 2.4 V; VO(p-p) = 1.13 V (at -7.96 dBV); for TDA1308A only. TEST AND APPLICATION INFORMATION
TDA1308; TDA1308A
handbook, full pagewidth
VDD 3.9 k 100 F VOUTA RL 1 2 3 Vref (typ. 2.5 V) 3.9 k VINB 8
3.9 k VINA
TDA1308(A)
5 6 7 4
C6 100 F
3.9 k
100 F VOUTB RL
MKA782
Fig.4 Measurement circuit for inverting application.
2002 Jul 19
6
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
V pagewidth handbook, full DD C5 C2 10 F C1 100 nF R1 22 k 1 nF R3 3.9 k 1 8 C7 100 F R5 10 k
5 BCK 1 8 R2 WS 2 Vref
2 3
TDA1545A
7 33 k
TDA1308(A)
5 6
C6 100 F
DATA
3 4
6 C3 1 F
7 R4 3.9 k C4 1 nF
4
C8 100 F R6 10 k
MKA783
Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).
MKA784
handbook, halfpage
handbook, halfpage
-70
MKA785
80 Gv (dB) 40 RL = 32 no load
Gv (dB) -90
RL = 16 -110 32
0 5 k 10-2 10-3 10-4 10-5 10-6 10-7 10-8 fi (Hz) -130 10-1
10-2
10-3
10-4
fi (Hz)
10-5
Fig.6
Open-loop gain as a function of input frequency.
Fig.7 Crosstalk as a function of input frequency.
2002 Jul 19
7
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
handbook, halfpage
100
MKA786
Po (mW) 60
RL = 16 32
40
8
20
10
3
4
5 VDD (V)
Fig.8 Output power as a function of supply voltage.
handbook, halfpage
-50
MKA787
(THD+N)/S (dB) -70 RL = 16 ; Po = 50 mW RL = 32 ; Po = 50 mW
-90 RL = 5 k; VO(p-p) = 3.5 V
-110 10-1
10-2
10-3
10-4
fi (Hz)
10-5
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.
2002 Jul 19
8
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
handbook, halfpage
-40
MKA788
(THD+N)/S (dB) -60 RL = 8 16 32
-80 5 k
f i = 1 kHz -100 10-2 10-1 1 VO(p-p) (V) 10
Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.
2002 Jul 19
9
Philips Semiconductors
Product specification
Class AB stereo headphone driver
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA1308; TDA1308A
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 EIAJ SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 95-02-04 99-12-27
2002 Jul 19
10
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2002 Jul 19
11
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308; TDA1308A
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c y HE vMA
Z
8
5
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
4
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.10 2.90 E(2) 3.10 2.90 e 0.65 HE 5.10 4.70 L 0.94 Lp 0.70 0.40 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-04-09
2002 Jul 19
12
Philips Semiconductors
Product specification
Class AB stereo headphone driver
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
TDA1308; TDA1308A
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 13
2002 Jul 19
Philips Semiconductors
Product specification
Class AB stereo headphone driver
Suitability of IC packages for wave, reflow and dipping soldering methods
TDA1308; TDA1308A
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
2002 Jul 19
14
Philips Semiconductors
Product specification
Class AB stereo headphone driver
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development
TDA1308; TDA1308A
DEFINITIONS This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Jul 19
15
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/03/pp16
Date of release: 2002
Jul 19
Document order number:
9397 750 09985

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